Corning 7979 IR Wafer Diameter 125mm
- Product Item : HYRD-W007
- Category： Wafers
- Material: Corning 7979 IR Grade
- Diameter: 125,0mm + 0 /- 0,3 mm
- Thickness = 2,0mm +/- 0,05mm
- Clear aperture: 90 % central
Corning 7979 IR Wafer Diameter 125mm
Product Parameters
▪ Material: fused silica Corning 7979 IR grade
Inclusion class 0
Homogeneity Grade F
▪ Application wavelength: 1064nm
▪ Diameter: 125,0mm + 0 /- 0,3 mm
▪ Thickness = 2,0mm +/- 0,05mm
▪ Clear aperture: 90 % central
▪ Flatness < Lambda/4 @ 633 nm over 25mm sub-aperture
▪ Surface imperfection tolerances: 5 / 10 x 0,04 ISO 10110-7
▪ Surface Roughness: <1nm (Rq)
▪ Double face polishing (Polishing: P4)
▪ Scratch/Dig: 20-10 min.
▪ Parallelism < 1 arcmin
▪ Bevel: 0.3mm-0.5mm face width@45°
▪ No flat
Introduction
Fused silica wafers are thin sheets made of high-purity quartz crystals that can oscillate freely and exhibit extremely high stability and accuracy in terms of physical properties. In the production process of semiconductor chips, quartz wafers are mainly used in circuits such as clocks, oscillators, and filters. The application of quartz wafer is indispensable in synchronous data transmission, beat control, and other aspects. In addition, quartz wafers can also be used as optical windows or acoustic filters etc. in various electronic devices.
Size: 2 inch, 3 inch, 4 inch, 5 inch, 6 inch, 8 inch, 10 inch, 12 inch. Other size is customized.
Thickness: 0.5mm, 1mm, 2mm, 3mm, 4mm, 6mm. Other thickness is customized.
Application of Quartz Wafer
A Sensor
B High frequency circuit/microwave circuit
C IoT array
D Laser Optics
E Optical Window and Lens
Characteristics of quartz wafers
A high temperature resistance
B Outstanding thermal conductivity
C Corrosion resistance
D Excellent mechanical properties
E Insulation
F-high optical transmission efficiency
Product Parameters
▪ Material: fused silica Corning 7979 IR grade
Inclusion class 0
Homogeneity Grade F
▪ Application wavelength: 1064nm
▪ Diameter: 125,0mm + 0 /- 0,3 mm
▪ Thickness = 2,0mm +/- 0,05mm
▪ Clear aperture: 90 % central
▪ Flatness < Lambda/4 @ 633 nm over 25mm sub-aperture
▪ Surface imperfection tolerances: 5 / 10 x 0,04 ISO 10110-7
▪ Surface Roughness: <1nm (Rq)
▪ Double face polishing (Polishing: P4)
▪ Scratch/Dig: 20-10 min.
▪ Parallelism < 1 arcmin
▪ Bevel: 0.3mm-0.5mm face width@45°
▪ No flat
Introduction
Fused silica wafers are thin sheets made of high-purity quartz crystals that can oscillate freely and exhibit extremely high stability and accuracy in terms of physical properties. In the production process of semiconductor chips, quartz wafers are mainly used in circuits such as clocks, oscillators, and filters. The application of quartz wafer is indispensable in synchronous data transmission, beat control, and other aspects. In addition, quartz wafers can also be used as optical windows or acoustic filters etc. in various electronic devices.
Size: 2 inch, 3 inch, 4 inch, 5 inch, 6 inch, 8 inch, 10 inch, 12 inch. Other size is customized.
Thickness: 0.5mm, 1mm, 2mm, 3mm, 4mm, 6mm. Other thickness is customized.
Application of Quartz Wafer
A Sensor
B High frequency circuit/microwave circuit
C IoT array
D Laser Optics
E Optical Window and Lens
Characteristics of quartz wafers
A high temperature resistance
B Outstanding thermal conductivity
C Corrosion resistance
D Excellent mechanical properties
E Insulation
F-high optical transmission efficiency
